Invention Grant
- Patent Title: Electronic device and semiconductor package with thermally conductive via
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Application No.: US14826207Application Date: 2015-08-14
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Publication No.: US09674940B2Publication Date: 2017-06-06
- Inventor: Eung-chang Lee , Seok-jae Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2014-0105710 20140814; KR10-2015-0097866 20150709
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/11 ; H01L23/00 ; H01L23/367 ; H01L23/498 ; H01L25/065
Abstract:
An electronic device and semiconductor package include a printed circuit board and a semiconductor device mounted thereon. The printed circuit board includes one or more thermally conductive vias for dissipating heat.
Public/Granted literature
- US20160050744A1 ELECTRONIC DEVICE AND SEMICONDUCTOR PACKAGE WITH THERMALLY CONDUCTIVE VIA Public/Granted day:2016-02-18
Information query
