A method is performed at least in part by at least one processor. In the method, a plurality of circuit elements are placed in a layout for a semiconductor device, the plurality of circuit elements having a plurality of pins. A layer assignment is generated to assign a plurality of interconnections to corresponding conductive layers of the semiconductor device, the plurality of interconnections connecting corresponding pairs of pins among the plurality of pins. The plurality of interconnections is routed in the layout in accordance with the layer assignment.