- 专利标题： Light-emitting device, method of manufacturing the same, method of mounting the same and lighting device
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申请号： US12926253申请日： 2010-11-04
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公开(公告)号： US09653661B2公开(公告)日： 2017-05-16
- 发明人: Yoshinobu Suehiro , Seiji Yamaguchi , Katsunori Arakane , Koji Tasumi
- 申请人： Yoshinobu Suehiro , Seiji Yamaguchi , Katsunori Arakane , Koji Tasumi
- 申请人地址： JP Kiyosu-Shi, Aichi-Ken
- 专利权人： TOYODA GOSEI CO., LTD.
- 当前专利权人： TOYODA GOSEI CO., LTD.
- 当前专利权人地址： JP Kiyosu-Shi, Aichi-Ken
- 代理机构： McGinn IP Law Group, PLLC.
- 优先权： JP2009-264095 20091119; JP2010-062514 20100318
- 主分类号： H01L21/603
- IPC分类号： H01L21/603 ; H01L33/56 ; H01L33/54 ; H01L23/00 ; H01L25/075 ; H01L33/48
摘要：
A method of manufacturing a light-emitting device includes a hole forming process for forming a through-hole that continues from a front surface to a back surface of a mounting substrate, a pattern forming process for continuously forming a circuit pattern on an inner surface of the through-hole in the mounting substrate, from an end portion of the through-hole on the front surface of the mounting substrate to a mounting portion of a light-emitting element, and on a periphery of the through-hole on the back surface of the mounting substrate, a mounting process for mounting the light-emitting element on the mounting portion, and a hot pressing process in that an inorganic material softened by heating is placed on the surface of the mounting substrate and is advanced into the through-hole while sealing the light-emitting element by pressing and bonding the inorganic material to the surface of the mounting substrate.
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