Invention Grant
- Patent Title: Semiconductor device, manufacturing method, and electronic apparatus
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Application No.: US14189068Application Date: 2014-02-25
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Publication No.: US09647146B2Publication Date: 2017-05-09
- Inventor: Satoru Wakiyama , Taizo Takachi
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-046835 20130308
- Main IPC: H01L31/0203
- IPC: H01L31/0203 ; H01L31/0216 ; H01L31/18 ; H01L31/041 ; H01L27/146
Abstract:
A method of manufacturing a semiconductor device includes: forming, on a cover glass, a film having a predetermined specific gravity and configured to shield an alpha ray that arises from the cover glass; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device.
Public/Granted literature
- US20140252526A1 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS Public/Granted day:2014-09-11
Information query
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