Invention Grant
- Patent Title: Rectangular wire edgewise-bending processing device and rectangular wire edgewise-bending processing method
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Application No.: US14646876Application Date: 2014-01-21
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Publication No.: US09646764B2Publication Date: 2017-05-09
- Inventor: Yutaro Shirai , Hiroyuki Akita , Atsushi Sakaue , Shinichiro Yoshida , Masaya Inoue
- Applicant: MITSUBISHI ELECTRIC CORPORATION
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2013-008931 20130122
- International Application: PCT/JP2014/051061 WO 20140121
- International Announcement: WO2014/115703 WO 20140731
- Main IPC: H01F41/06
- IPC: H01F41/06 ; B21F3/04 ; B21F1/00 ; H02K15/04 ; H01F41/082 ; H01F41/071 ; H01F17/04
Abstract:
Provided is a rectangular wire edgewise-bending processing device for performing an edgewise-bending process for a rectangular wire to form a coil, the rectangular wire edgewise-bending processing device including a fixing unit for fixing the rectangular wire, a pressing tool for pressing a surface formed by a long side of a rectangular cross section of the rectangular wire, and a bending tool for bending the rectangular wire into a predetermined coil shape, wherein the edgewise-bending process is performed while the surface formed by the long side of the rectangular cross section of the rectangular wire is pressed.
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