Invention Grant
- Patent Title: Conductor pad for flexible circuits and flexible circuit incorporating the same
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Application No.: US14292829Application Date: 2014-05-31
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Publication No.: US09635759B2Publication Date: 2017-04-25
- Inventor: Sridharan Venk , Earl Alfred Picard, Jr. , Qi Dai , Richard Garner
- Applicant: Sridharan Venk , Earl Alfred Picard, Jr. , Qi Dai , Richard Garner
- Applicant Address: US MA Wilmington
- Assignee: OSRAM SYLVANIA Inc.
- Current Assignee: OSRAM SYLVANIA Inc.
- Current Assignee Address: US MA Wilmington
- Agent Shaun P. Montana
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/30 ; H05K1/02 ; H01L23/00 ; F21S4/22 ; F21V21/005 ; H01L33/38 ; H05K1/18 ; H05K3/00 ; H05K3/02 ; H05K3/28 ; H01L33/62 ; G06K19/077 ; H01L33/44

Abstract:
A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.
Public/Granted literature
- US20150049444A1 CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORATING THE SAME Public/Granted day:2015-02-19
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