- 专利标题： Method for direct metallization of non-conductive substrates
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申请号： US13636087申请日： 2011-03-21
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公开(公告)号： US09617644B2公开(公告)日： 2017-04-11
- 发明人: Andreas Königshofen , Danica Elbick , Markus Dahlhaus
- 申请人： Andreas Königshofen , Danica Elbick , Markus Dahlhaus
- 代理机构： Carmody Torrance Sandak & Hennessey LLP
- 优先权： DE102010012204 20100319
- 国际申请： PCT/US2011/029194 WO 20110321
- 国际公布： WO2011/116376 WO 20110922
- 主分类号： C23C18/54
- IPC分类号： C23C18/54 ; C23C18/28 ; C23C18/30 ; C23C18/40 ; C23C18/16 ; C23C18/20 ; C23C18/34 ; C23C18/36 ; C23C18/44 ; C23C18/52 ; C25D11/00
摘要：
The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent.
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