Invention Grant
- Patent Title: Endoscope bending module manufacturing method
- Patent Title (中): 内镜弯曲模块制造方法
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Application No.: US14368223Application Date: 2012-12-18
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Publication No.: US09591963B2Publication Date: 2017-03-14
- Inventor: Jin-won Lee , Mun-kue Park , Su-Kwang Lim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2011-0141598 20111223
- International Application: PCT/KR2012/011073 WO 20121218
- International Announcement: WO2013/094965 WO 20130627
- Main IPC: A61B1/005
- IPC: A61B1/005 ; A61B1/008 ; A61B1/00

Abstract:
Provided is a manufacturing method of a bending module that forms a plurality of joint members by press-processing sheet material, with each joint member having a joint member body, a connection protrusion and a wire guide protrusion having a wire guide hole formed at one side corner of the joint member body, and one connection protrusion is formed at another side corner of the joint member body. The wire guide protrusions are folded with respect to the joint member bodies; a joint member assembly is formed by arranging the plurality of joint members in parallel and connecting neighboring connection members to connect the joint members together; the joint member assembly are bent to a ring shape; and each joint member is connect to each other by welding corners thereof.
Public/Granted literature
- US20140378767A1 ENDOSCOPE BENDING MODULE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-12-25
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