Invention Grant
- Patent Title: Electron beam lithography process with multiple columns
- Patent Title (中): 电子束光刻工艺与多列
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Application No.: US14695617Application Date: 2015-04-24
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Publication No.: US09589764B2Publication Date: 2017-03-07
- Inventor: Wen-Chuan Wang , Shy-Jay Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G21K5/04
- IPC: G21K5/04 ; H01J37/26 ; H01J37/147 ; H01J37/317

Abstract:
The present disclosure provides methods of electron-beam (e-beam) lithography process. The method includes loading a substrate to an electron-beam (e-beam) system such that a first subset of fields defined on the substrate is arrayed on the substrate along a first direction. The method also includes positioning a plurality of e-beam columns having a first subset of e-beam columns arrayed along the first direction. The e-beam columns of the first subset of e-beam columns are directed to different ones of the first subset of fields. The method also includes performing a first exposing process in a scan mode such that the plurality of e-beam columns scans the substrate along the first direction.
Public/Granted literature
- US20160284504A1 Electron-Beam Lithography Process with Multiple Columns Public/Granted day:2016-09-29
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