Invention Grant
US09583842B2 System and method for attaching solder balls and posts in antenna areas
有权
用于在天线区域中焊锡球和支柱的系统和方法
- Patent Title: System and method for attaching solder balls and posts in antenna areas
- Patent Title (中): 用于在天线区域中焊锡球和支柱的系统和方法
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Application No.: US14754823Application Date: 2015-06-30
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Publication No.: US09583842B2Publication Date: 2017-02-28
- Inventor: Elimelech Ganchrow , Alon Yehezkely
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H01Q21/00
- IPC: H01Q21/00 ; H01Q21/28 ; H01Q1/24 ; H01Q1/22 ; H01Q21/06 ; H01Q1/38 ; H01Q23/00
Abstract:
Aspects of the present disclosure provide an apparatus for wireless communications. The apparatus generally includes a printed circuit board (PCB) and a plurality of antenna elements. Each of the plurality of antenna elements is mechanically attached to a perimeter of the PCB via one or more solder elements. Each of the solder elements are spaced apart from each other and electrically isolated from each other in a vicinity of the antenna elements.
Public/Granted literature
- US20160006133A1 SYSTEM AND METHOD FOR ATTACHING SOLDER BALLS AND POSTS IN ANTENNA AREAS Public/Granted day:2016-01-07
Information query
