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US09577077B2 Well controlled conductive dot size in flash memory 有权
闪存中控制良好的导电点尺寸

Well controlled conductive dot size in flash memory
Abstract:
Some embodiments of the present disclosure relate to a method for forming flash memory. In this method, a first tunnel oxide is formed over a semiconductor substrate. A self-assembled monolayer (SAM) is then formed on the first tunnel oxide. The SAM includes spherical or spherical-like crystalline silicon dots having respective diameters which are less than approximately 30 nm. A second tunnel oxide is then formed over the SAM.
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