Invention Grant
- Patent Title: Semiconductor memory device and method of manufacturing the same
- Patent Title (中): 半导体存储器件及其制造方法
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Application No.: US14879625Application Date: 2015-10-09
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Publication No.: US09570682B2Publication Date: 2017-02-14
- Inventor: Takumi Mikawa , Takashi Okada
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2009-197818 20090828
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/10

Abstract:
Provided are a variable resistance semiconductor memory device which changes its resistance without being affected by an underlying layer and is suitable as a memory device of increased capacity, and a method of manufacturing the same. The semiconductor memory device in the present invention includes: a first contact plug formed inside a first contact hole penetrating through a first interlayer insulating layer; a lower electrode having a flat top surface and is thicker above the first interlayer insulating layer than above the first contact plug; a variable resistance layer; and an upper electrode. The lower electrode, the variable resistance layer, and the upper electrode compose a variable resistance element.
Public/Granted literature
- US20160035976A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-02-04
Information query
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