发明授权
US09570369B1 Semiconductor package with sidewall-protected RDL interposer and fabrication method thereof
有权
具有侧壁保护的RDL插入件的半导体封装及其制造方法
- 专利标题： Semiconductor package with sidewall-protected RDL interposer and fabrication method thereof
- 专利标题（中）： 具有侧壁保护的RDL插入件的半导体封装及其制造方法
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申请号： US15068649申请日： 2016-03-14
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公开(公告)号： US09570369B1公开(公告)日： 2017-02-14
- 发明人: Shing-Yih Shih , Tieh-Chiang Wu
- 申请人： INOTERA MEMORIES, INC.
- 申请人地址： TW Taoyuan
- 专利权人： INOTERA MEMORIES, INC.
- 当前专利权人： INOTERA MEMORIES, INC.
- 当前专利权人地址： TW Taoyuan
- 代理商 Winston Hsu; Scott Margo
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/31 ; H01L25/065 ; H01L25/00 ; H01L23/498 ; H01L21/56 ; H01L21/78
摘要：
A semiconductor package includes a redistributed layer (RDL) interposer having a first side, a second side opposite to the first side, and a vertical sidewall extending between the first side and the second side; at least one semiconductor die mounted on the first side of the RDL interposer; a molding compound disposed on the first side and covering the at least one semiconductor die and the vertical sidewall of the RDL interposer; and a plurality of solder bumps or solder balls mounted on the second side.
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