An apparatus for providing a patterned structure includes a deposition facility for depositing an electrically conductive material on a cylindrical surface of a transfer roll, a supply facility for providing a flexible substrate with a carrier layer, a press-roll for pressing the flexible substrate with the carrier layer against the surface of the transfer roll, the press-roll being positioned in the rotation direction of the transfer roll with respect to a position where the first deposition facility deposits the substance on the transfer roll, and being arranged for embedding the deposited substance in said carrier layer, wherein the adhesion between the printed substance and the cylindrical surface of the transfer roll is less than the adhesion between the printed substance and said carrier layer, a transport facility for releasing the flexible substrate with the carrier layer embedding the substance as the patterned structure from the transfer roll.