发明授权
- 专利标题： DIMM connector region vias and routing
- 专利标题（中）： DIMM连接器区域通孔和路由
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申请号： US14833729申请日： 2015-08-24
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公开(公告)号： US09548551B1公开(公告)日： 2017-01-17
- 发明人: Wiren D. Becker , William L. Brodsky , Matteo Cocchini , Michael A. Cracraft
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理机构： Cantor Colburn LLP
- 代理商 Margaret A. McNamara
- 主分类号： H01R12/70
- IPC分类号： H01R12/70 ; H01R43/20
摘要：
A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.
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