Invention Grant
- Patent Title: Bone conduction speaker unit
- Patent Title (中): 骨传导扬声器单元
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Application No.: US14431854Application Date: 2014-07-17
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Publication No.: US09532135B2Publication Date: 2016-12-27
- Inventor: Takeshi Takeda , Yasuhide Terasawa
- Applicant: TEMCO JAPAN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TEMCO JAPAN CO., LTD
- Current Assignee: TEMCO JAPAN CO., LTD
- Current Assignee Address: JP Tokyo
- Agency: Browdy and Neimark, P.L.L.C.
- Priority: JP2013-182141 20130903
- International Application: PCT/JP2014/069055 WO 20140717
- International Announcement: WO2015/033677 WO 20150312
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/46 ; H04R1/02 ; H04R1/06 ; H01R24/58

Abstract:
Problem is to provide a bone conduction speaker unit which is compact as a whole, and can be used, being simply and neatly mounted to a great variety of pieces of existing communication equipment, such as mobile phones. A unit case 1 is provided which incorporates a bone conduction speaker 2 such that a diaphragm 3 is exposed, with an earphone-jack mating plug 4, which is connected to the bone conduction speaker 2, being disposed on the unit case 1, and by connecting the plug 4 to an earphone jack 22 on a cabinet 21 of a piece of communication equipment, such as a mobile phone, the piece of communication equipment is allowed to be used as a speaker.
Public/Granted literature
- US20150289052A1 BONE CONDUCTION SPEAKER UNIT Public/Granted day:2015-10-08
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