发明授权
- 专利标题： Chip package and chip assembly
- 专利标题（中）： 芯片封装和芯片组装
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申请号： US14880373申请日： 2015-10-12
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公开(公告)号： US09530754B2公开(公告)日： 2016-12-27
- 发明人: Khalil Hosseini , Joachim Mahler , Franz-Peter Kalz , Joachim Voelter , Ralf Wombacher
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/60 ; H01L23/48 ; H01L21/50 ; H01L21/56 ; H01L25/065 ; H01L23/495 ; H01L23/00 ; H01L23/492 ; H01L23/498 ; H01L23/31
摘要：
A chip package is provided. The chip package may include an electrically conductive carrier; at least one first chip including a first side and a second side opposite of the first side, with its second side being electrically contacted to the electrically conductive carrier; an insulating layer over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip; at least one second chip arranged over the insulating layer and next to the first chip; encapsulating material over the first chip and the second chip; and electrical contacts which extend through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip.
公开/授权文献
- US20160035700A1 CHIP PACKAGE AND CHIP ASSEMBLY 公开/授权日：2016-02-04
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