A thermal module connection structure providing a substrate, a heat generation unit disposed on the substrate, includes: a heat dissipation unit disposed on the heat generation unit, a protrusion section outward extending from each of two sides of the heat dissipation unit; and a locating assembly including a first locating member and a second locating member mounted on two sides of the heat generation unit, which sides are free from the protrusion sections. A carrier member is disposed at each of two ends of the first locating member. The protrusion sections of the heat dissipation unit are positioned on the carrier members. One end of the carrier member is pivotally connected with the first locating member, while the other end is latched with the second locating member. The carrier member has a press member for pressing the protrusion section against the carrier member to fix the heat dissipation unit.