A system for dissipating thermal energy from an enclosure includes a gusset having a base engagement face and an enclosure engagement face that may be removably coupled with the enclosure. In some embodiments, a heat pipe extends along a gusset frame between portions of the base engagement face and the enclosure engagement face. The heat pipe is angularly shaped in various embodiments and is thermally coupled with the base engagement face and the enclosure engagement face. In some embodiments, the heat pipe is coupled within a heat pipe channel that extends along a length of the gusset.