Invention Grant
US09496206B2 Flippable leadframe for packaged electronic system having vertically stacked chips and components
有权
具有垂直堆叠的芯片和组件的封装电子系统的易碎引线框架
- Patent Title: Flippable leadframe for packaged electronic system having vertically stacked chips and components
- Patent Title (中): 具有垂直堆叠的芯片和组件的封装电子系统的易碎引线框架
-
Application No.: US14683277Application Date: 2015-04-10
-
Publication No.: US09496206B2Publication Date: 2016-11-15
- Inventor: Lee Han Meng@ Eugene Lee , Anis Fauzi Bin Abdul Aziz , Sueann Lim Wei Fen
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Rose Alyssa Keagy; Frank D. Cimino
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L23/31
Abstract:
A leadframe (100) for electronic systems comprising a first sub-leadframe (110) connected by links (150) to a second sub-leadframe (120), the first and second sub-leadframe connected by tiebars (111, 121) to a frame (130); and each link having a neck (151) suitable for bending the link, the necks arrayed in a line (170) operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots.
Public/Granted literature
- US20160300784A1 FLIPPABLE LEADFRAME FOR PACKAGED ELECTRONIC SYSTEM HAVING VERTICALLY STACKED CHIPS AND COMPONENTS Public/Granted day:2016-10-13
Information query
IPC分类:
