发明授权
- 专利标题： Interconnection card for inspection, manufacture method for interconnection card, and inspection method using interconnection card
- 专利标题（中）： 互连卡互连卡，互连卡的制造方法和使用互连卡的检验方法
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申请号： US13667501申请日： 2012-11-02
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公开(公告)号： US09476914B2公开(公告)日： 2016-10-25
- 发明人: Takeshi Shioga , Kazuaki Kurihara
- 申请人： FUJITSU LIMITED
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 主分类号： H05K3/10
- IPC分类号： H05K3/10 ; G01R3/00 ; G01R1/073
摘要：
Recesses are formed on one surface of a substrate. A conductive film covers an inner surface of each of the recesses. This conductive film contacts a bump of a semiconductor device to be inspected and is electrically connected to the bump. It is therefore possible to prevent damages of the bump to be caused by contact of a probe pin.
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