Invention Grant
- Patent Title: Earset
- Patent Title (中): 花束
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Application No.: US14837157Application Date: 2015-08-27
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Publication No.: US09473842B2Publication Date: 2016-10-18
- Inventor: Doo Sik Shin
- Applicant: Haebora Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: Haebora Co., Ltd.
- Current Assignee: Haebora Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Hammer & Associates, P.C.
- Priority: KR10-2014-0118585 20140905; KR10-2015-0047305 20150403
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10 ; H04R3/00

Abstract:
Disclosed is an earset. The earset includes a case that forms an appearance thereof, an ear pad that is mounted in one end portion of the case and is attached to/detached from a user's ear, and a soundproof housing that is accommodated in the case and in which a speaker and a microphone are arranged in a forward/backward direction along an axial line of the ear pad.
Public/Granted literature
- US20160073187A1 EARSET Public/Granted day:2016-03-10
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