发明授权
- 专利标题： Substrate processing apparatus and substrate processing method
- 专利标题（中）： 基板加工装置及基板处理方法
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申请号： US13906546申请日： 2013-05-31
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公开(公告)号： US09449857B2公开(公告)日： 2016-09-20
- 发明人: Hiroaki Inadomi
- 申请人： Tokyo Electron Limited
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Abelman, Frayne & Schwab
- 优先权： JP2012-131026 20120608
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/02
摘要：
A substrate processing apparatus is provided including: a liquid processing unit that processes a substrate with a processing liquid; a carry-in port formed in the liquid processing unit and configured to carry-in the substrate in a dry-state before the substrate is processed with the processing liquid; a carry-out port formed in the liquid processing unit and configured to carry-out the substrate in a wet-state after completing the liquid processing; a supercritical dry processing unit that performs a dry processing for the substrate using a supercritical fluid; a first substrate transport unit that transports the substrate in a dry-state before the substrate is processed with the processing liquid to the carry-out port of the liquid processing unit; and a second substrate transport unit that transports the substrate in a wet-state after completing the liquid processing from the carry-out port of the liquid processing unit to the supercritical dry processing unit.
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