Invention Grant
- Patent Title: Printed chemical mechanical polishing pad having abrasives therein
- Patent Title (中): 具有磨料的印刷化学机械抛光垫
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Application No.: US14511057Application Date: 2014-10-09
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Publication No.: US09421666B2Publication Date: 2016-08-23
- Inventor: Kasiraman Krishnan , Nag B. Patibandla , Periya Gopalan
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B33Y10/00 ; B33Y80/00 ; B24D3/28 ; B24D18/00 ; B29C67/00 ; B29K101/10 ; B29K105/16
Abstract:
A method of fabricating a polishing layer of a polishing pad includes determining a desired distribution of particles to be embedded within a polymer matrix of the polishing layer. A plurality of layers of the polymer matrix is successively deposited with a 3D printer, each layer of the plurality of layers of polymer matrix being deposited by ejecting a polymer matrix precursor from a nozzle. A plurality of layers of the particles is successively deposited according to the desired distribution with the 3D printer. The polymer matrix precursor is solidified into a polymer matrix having the particles embedded in the desired distribution.
Public/Granted literature
- US20150126099A1 PRINTED CHEMICAL MECHANICAL POLISHING PAD HAVING ABRASIVES THEREIN Public/Granted day:2015-05-07
Information query
