Invention Grant
US09410025B2 Polyolefin-based resin expanded beads comprising inorganic fillers
有权
包含无机填料的聚烯烃类树脂发泡珠粒
- Patent Title: Polyolefin-based resin expanded beads comprising inorganic fillers
- Patent Title (中): 包含无机填料的聚烯烃类树脂发泡珠粒
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Application No.: US14555967Application Date: 2014-11-28
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Publication No.: US09410025B2Publication Date: 2016-08-09
- Inventor: Shota Takagi , Akinobu Hira , Kazutoshi Sasaki
- Applicant: JSP CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSP CORPORATION
- Current Assignee: JSP CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2013-256534 20131211
- Main IPC: B32B5/16
- IPC: B32B5/16 ; C08J9/228 ; B29C44/04 ; B29C44/34 ; B29C44/44 ; C08J9/00 ; C08J9/16 ; C08J9/224 ; C08J9/232

Abstract:
An inorganic filler-containing, polyolefin-based resin expanded bead having an expanded core layer of a first polyolefin-based resin, and a cover layer of a second polyolefin-based resin that covers the expanded core layer, wherein a weight ratio of the cover layer to the expanded core layer is 1:99 to 20:80, the expanded core layer contains an inorganic filler in a weight percentage amount of 5 to 90%, and the cover layer contains no inorganic filler or contains an inorganic filler in a weight percentage amount lower than that in the expanded core layer.
Public/Granted literature
- US20150158990A1 POLYOLEFIN-BASED RESIN EXPANDED BEADS Public/Granted day:2015-06-11
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