发明授权
- 专利标题: Method and apparatus for efficient hierarchical chip testing and diagnostics with support for partially bad dies
- 专利标题(中): 用于高效分级芯片测试和诊断的方法和装置,支持部分坏死模
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申请号: US14530218申请日: 2014-10-31
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公开(公告)号: US09404969B1公开(公告)日: 2016-08-02
- 发明人: Brion L. Keller , Steven M. Douskey , Mary Kusko
- 申请人: Cadence Design Systems, Inc. , International Business Machines Corporation
- 申请人地址: US CA San Jose US NY Armonk
- 专利权人: CADENCE DESIGN SYSTEMS, INC.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: CADENCE DESIGN SYSTEMS, INC.,INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US CA San Jose US NY Armonk
- 代理机构: Sawyer Law Group, P.C.
- 主分类号: G01R31/3177
- IPC分类号: G01R31/3177 ; G01R31/28 ; G01R31/317 ; G06F11/277 ; G01R31/3185 ; G01R31/3187 ; G06F11/27 ; G06F11/22
摘要:
SOC and other chip designs increasingly feature IP cores, and many copies of the same core may be present in a single chip. Using wrapped cores, it is possible to determine which cores are defective on a chip during test. Multiple instances of identical cores may be tested in parallel to easily determine which cores are failing. The cores compare a signature generated during test of the core against an expected signature, having a pass/fail bit as a result. The pass/fail bits may be multiplexed at an output pin where output pins are at a premium relative to the number of core instances or the pass/fail bit stored in a register to be later serially-unloaded from the chip. The disclosed embodiments provide for masking circuitry, as well as both identical and different core instances to be run serially and in parallel.
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