发明授权
- 专利标题： Substrate processing method and substrate processing apparatus
- 专利标题（中）： 基板处理方法和基板处理装置
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申请号： US14475015申请日： 2014-09-02
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公开(公告)号： US09403187B2公开(公告)日： 2016-08-02
- 发明人: Sei Negoro , Ryo Muramoto , Yasuhiko Nagai , Tsutomu Osuka , Keiji Iwata
- 申请人： DAINIPPON SCREEN MFG. CO., LTD.
- 申请人地址： JP
- 专利权人： SCREEN Holdings Co., Ltd.
- 当前专利权人： SCREEN Holdings Co., Ltd.
- 当前专利权人地址： JP
- 代理机构： Ostrolenk Faber LLP
- 优先权： JP2013-181509 20130902
- 主分类号： B44C1/22
- IPC分类号： B44C1/22 ; B05D3/10 ; B05D1/36 ; H01L21/67
摘要：
A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off the liquid remaining on the substrate, a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate, and a temperature decrease suppressing step of supplying, in parallel to the hydrogen peroxide water supplying step, pure water having high temperature to a lower surface of the substrate.
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