- 专利标题： Bonded structures for package and substrate
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申请号： US14840811申请日： 2015-08-31
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公开(公告)号： US09397059B2公开(公告)日： 2016-07-19
- 发明人: Ming-Hong Cha , Chen-Shien Chen , Chen-Cheng Kuo , Tsung-Hsien Chiang , Hao-Juin Liu , Yao-Chun Chuang , Chita Chuang
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/768 ; H01L23/498 ; H01L25/065
摘要：
The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.
公开/授权文献
- US20150371964A1 Bonded Structures for Package and Substrate 公开/授权日：2015-12-24
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