发明授权
- 专利标题: Semiconductor device and method for manufacturing semiconductor device
- 专利标题(中): 半导体装置及半导体装置的制造方法
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申请号: US14464952申请日: 2014-08-21
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公开(公告)号: US09390781B2公开(公告)日: 2016-07-12
- 发明人: Osamu Matsuura
- 申请人: FUJITSU SEMICONDUCTOR LIMITED
- 申请人地址: JP Yokohama, Kanagawa
- 专利权人: FUJITSU SEMICONDUCTOR LIMITED
- 当前专利权人: FUJITSU SEMICONDUCTOR LIMITED
- 当前专利权人地址: JP Yokohama, Kanagawa
- 代理机构: Westerman, Hattori, Daniels & Adrian, LLP
- 优先权: JP2013-178209 20130829
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; G11C11/22 ; H01L29/51 ; H01L27/115
摘要:
A semiconductor device includes a transistor formed on a semiconductor substrate, a first insulation film formed above the semiconductor substrate, and first and second capacitors located on the first insulation film. The first capacitor includes a lower electrode, a ferroelectric, and an upper electrode. One of the lower electrode and the upper electrode is connected to an impurity region of the transistor. The second capacitor includes a first electrode, a first dielectric, a second electrode, a second dielectric, and a third electrode. The lower electrode is formed from the same material as the first electrode, the ferroelectric is formed from the same material as the first dielectric, and the upper electrode is formed from the same material as the second electrode.
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