发明授权
- 专利标题： Circuit substrate and method of forming circuit pattern
- 专利标题（中）： 电路基板和形成电路图案的方法
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申请号： US14363184申请日： 2012-11-06
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公开(公告)号： US09386707B2公开(公告)日： 2016-07-05
- 发明人: Takashi Iwade , Shinya Izumida , Kazuyuki Shishino , Kiyohito Yamamoto , Shigeru Tohno
- 申请人： TORAY ENGINEERING CO., LTD.
- 申请人地址： JP Tokyo
- 专利权人： TORAY ELECTRONICS CO., LTD.
- 当前专利权人： TORAY ELECTRONICS CO., LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： Troutman Sanders LLP
- 优先权： JP2011-269873 20111209
- 国际申请： PCT/JP2012/078669 WO 20121106
- 国际公布： WO2013/084640 WO 20130613
- 主分类号： H05K3/12
- IPC分类号： H05K3/12 ; H05K1/02
摘要：
With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having a liquid repellency to the conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed. Thereby, the conductive ink is applied to the lyophilic region, while the conductive ink is repelled at the remaining liquid-repellent region and flows into the lyophilic region.
公开/授权文献
- US20140353016A1 CIRCUIT SUBSTRATE AND METHOD OF FORMING CIRCUIT PATTERN 公开/授权日：2014-12-04
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