Circuit substrate and method of forming circuit pattern
    1.
    发明授权
    Circuit substrate and method of forming circuit pattern 有权
    电路基板和形成电路图案的方法

    公开(公告)号:US09386707B2

    公开(公告)日:2016-07-05

    申请号:US14363184

    申请日:2012-11-06

    IPC分类号: H05K3/12 H05K1/02

    摘要: With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having a liquid repellency to the conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed. Thereby, the conductive ink is applied to the lyophilic region, while the conductive ink is repelled at the remaining liquid-repellent region and flows into the lyophilic region.

    摘要翻译: 当喷嘴沿一个方向移动到基板单元时,导电油墨以带状方式从喷嘴的狭缝排出到基板单元。 导电油墨以带状方式排放到具有对导电油墨具有疏液性的拒水区域的基板单元和对导电油墨具有亲液性的亲液性区域并具有与期望的相同的形式 形成电路图案。 由此,将导电油墨施加到亲液性区域,同时导电油墨在剩余的疏液区域排斥并流入亲液性区域。