发明授权
- 专利标题： Camera module and electronic device for cooling image sensor
- 专利标题（中）： 相机模块和用于冷却图像传感器的电子设备
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申请号： US13955703申请日： 2013-07-31
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公开(公告)号： US09386200B2公开(公告)日： 2016-07-05
- 发明人: Kazuhiro Hongo
- 申请人： Sony Corporation
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Chip Law Group
- 优先权： JP2012-186140 20120827
- 主分类号： F03G7/06
- IPC分类号： F03G7/06 ; H05K7/00 ; H04N5/225
摘要：
There is provided a camera module including an image sensor unit that is configured to include an image sensor and a mounting board, a sheet-shaped heat radiation member that comes into contact with a part of the image sensor unit and a component other than the image sensor unit and is elastically deformed so that an imaging surface of the image sensor unit is moved, and an actuator that elastically deforms the sheet-shaped heat radiation member so that the imaging surface of the image sensor unit is moved.
公开/授权文献
- US20140055670A1 CAMERA MODULE AND ELECTRONIC DEVICE 公开/授权日：2014-02-27
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