发明授权
- 专利标题： High density connector
- 专利标题（中）： 高密度连接器
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申请号： US14882833申请日： 2015-10-14
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公开(公告)号： US09385455B2公开(公告)日： 2016-07-05
- 发明人: Kent E. Regnier , Patrick R. Casher , Michael Rowlands
- 申请人： Molex, LLC
- 申请人地址： US IL Lisle
- 专利权人： Molex, LLC
- 当前专利权人： Molex, LLC
- 当前专利权人地址： US IL Lisle
- 代理商 Stephen L. Sheldon
- 主分类号： H01R13/648
- IPC分类号： H01R13/648 ; H01R12/70 ; H01R9/24 ; H01R12/72 ; H01R12/71 ; H01R13/652 ; H01R43/20
摘要：
A connector can be provided that allows for improved route-out including straight-back routing. Signal and ground terminal tails can be arranged in a single row to help facilitate such functionality. A commoning member can connect ground tails to ground terminals. Consequentially, a connector with two vertically stacked card slots can be provided that allows for straight back routing of the signal traces in four layers while still providing a compact connector design.
公开/授权文献
- US20160036147A1 HIGH DENSITY CONNECTOR 公开/授权日：2016-02-04
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