发明授权
- 专利标题: Card with built-in electronic component
- 专利标题(中): 内置电子元件卡
-
申请号: US13991843申请日: 2011-12-05
-
公开(公告)号: US09384436B2公开(公告)日: 2016-07-05
- 发明人: Jintaro Tatsu
- 申请人: Jintaro Tatsu
- 申请人地址: JP Tokyo
- 专利权人: Dai Nippon Printing Co., Ltd.
- 当前专利权人: Dai Nippon Printing Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Locke Lord LLP
- 代理商 James E. Armstrong, IV; Howard M. Gitten
- 优先权: JP2010-271995 20101206
- 国际申请: PCT/JP2011/078058 WO 20111205
- 国际公布: WO2012/077632 WO 20120614
- 主分类号: H05K1/14
- IPC分类号: H05K1/14 ; G06K19/077 ; G06K19/073 ; B42D25/00
摘要:
Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.
公开/授权文献
- US20140016286A1 CARD WITH BUILT-IN ELECTRONIC COMPONENT 公开/授权日:2014-01-16
信息查询