Invention Grant
- Patent Title: Semiconductor device including plural chips stacked to each other
- Patent Title (中): 包括彼此堆叠的多个芯片的半导体装置
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Application No.: US13358448Application Date: 2012-01-25
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Publication No.: US09378775B2Publication Date: 2016-06-28
- Inventor: Junichi Hayashi , Homare Sato
- Applicant: Junichi Hayashi , Homare Sato
- Applicant Address: LU Luxembourg
- Assignee: PS4 LUXCO S.A.R.L.
- Current Assignee: PS4 LUXCO S.A.R.L.
- Current Assignee Address: LU Luxembourg
- Agency: Kunzler Law Group, PC
- Priority: JP2011-016002 20110128
- Main IPC: G11C5/00
- IPC: G11C5/00 ; G11C7/00 ; G11C8/00 ; G11C5/06 ; G11C5/02

Abstract:
Such a device is disclosed that includes first and second chips stacked to each other, and a third chip controlling the first and second chips, stacked on the first and second chips, and including first, second and third output circuits. The first output circuit supplies a first command signal to the first chip. The second output circuit supplies the first command signal to the second chip. The third output circuit supplies a second command signal to the first and second chips.
Public/Granted literature
- US20120195090A1 SEMICONDUCTOR DEVICE INCLUDING PLURAL CHIPS STACKED TO EACH OTHER Public/Granted day:2012-08-02
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