Invention Grant
US09378775B2 Semiconductor device including plural chips stacked to each other 有权
包括彼此堆叠的多个芯片的半导体装置

Semiconductor device including plural chips stacked to each other
Abstract:
Such a device is disclosed that includes first and second chips stacked to each other, and a third chip controlling the first and second chips, stacked on the first and second chips, and including first, second and third output circuits. The first output circuit supplies a first command signal to the first chip. The second output circuit supplies the first command signal to the second chip. The third output circuit supplies a second command signal to the first and second chips.
Public/Granted literature
Information query
Patent Agency Ranking
0/0