Invention Grant
- Patent Title: Wafer-level lens systems and methods for manufacturing the same
- Patent Title (中): 晶圆级透镜系统及其制造方法
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Application No.: US14323846Application Date: 2014-07-03
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Publication No.: US09366848B2Publication Date: 2016-06-14
- Inventor: Chuen-Yi Yin , Jau-Jan Deng
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop & Gage LLP
- Main IPC: G02B13/18
- IPC: G02B13/18 ; G02B3/08 ; G02B9/00 ; G02B13/00 ; G02B9/12 ; B29D11/00

Abstract:
A wafer-level lens system includes one or more wafer-level lenses, each of the one or more wafer-level lenses having a substrate with opposing first and second surfaces, a first lens element of a first material and disposed on the first surface, and a second lens element of a second material and disposed on the second surface, wherein, for at least one of the one or more wafer-level lenses, the first material is different from the second material. Another wafer-level lens system includes three wafer-level lenses optically coupled in series with each other, each of the three wafer-level lenses having a substrate with opposing first and second surfaces, a first lens element disposed on the first surface and having an aspheric surface facing away from the first surface, and a second lens element disposed on the second surface and having an aspheric surface facing away from the second surface.
Public/Granted literature
- US20160004049A1 WAFER-LEVEL LENS SYSTEMS AND METHODS FOR MANUFACTURING THE SAME Public/Granted day:2016-01-07
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