Invention Grant
US09352541B2 Apparatus for temporary bonding of substrate on a carrier and method thereof
有权
用于将衬底临时粘结在载体上的装置及其方法
- Patent Title: Apparatus for temporary bonding of substrate on a carrier and method thereof
- Patent Title (中): 用于将衬底临时粘结在载体上的装置及其方法
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Application No.: US14090015Application Date: 2013-11-26
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Publication No.: US09352541B2Publication Date: 2016-05-31
- Inventor: Hayk Khachatryan
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin, Gyeonggi-Do
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2013-0075576 20130628
- Main IPC: B29C65/52
- IPC: B29C65/52 ; B32B37/12 ; B32B38/10 ; B32B43/00 ; C09J9/02 ; B29L31/34
Abstract:
An apparatus for temporarily bonding a substrate on a carrier includes an electrically conductive adhesion layer disposed between the carrier and the substrate, and a current supply source configured to apply a current to the electrically conductive adhesion layer.
Public/Granted literature
- US20150000838A1 APPARATUS FOR TEMPORARY BONDING OF SUBSTRATE ON A CARRIER AND METHOD THEREOF Public/Granted day:2015-01-01
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