Invention Grant
US09343665B2 Methods of forming a non-volatile resistive oxide memory cell and methods of forming a non-volatile resistive oxide memory array
有权
形成非易失性电阻氧化物存储单元的方法和形成非易失性电阻氧化物存储器阵列的方法
- Patent Title: Methods of forming a non-volatile resistive oxide memory cell and methods of forming a non-volatile resistive oxide memory array
- Patent Title (中): 形成非易失性电阻氧化物存储单元的方法和形成非易失性电阻氧化物存储器阵列的方法
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Application No.: US12166604Application Date: 2008-07-02
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Publication No.: US09343665B2Publication Date: 2016-05-17
- Inventor: Nishant Sinha , John Smythe , Bhaskar Srinivasan , Gurtej S. Sandhu , Joseph Neil Greeley , Kunal R. Parekh
- Applicant: Nishant Sinha , John Smythe , Bhaskar Srinivasan , Gurtej S. Sandhu , Joseph Neil Greeley , Kunal R. Parekh
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
A method of forming a non-volatile resistive oxide memory cell includes forming a first conductive electrode of the memory cell as part of a substrate. Metal oxide-comprising material is formed over the first conductive electrode. Etch stop material is deposited over the metal oxide-comprising material. Conductive material is deposited over the etch stop material. A second conductive electrode of the memory cell which comprises the conductive material received is formed over the etch stop material. Such includes etching through the conductive material to stop relative to the etch stop material and forming the non-volatile resistive oxide memory cell to comprise the first and second conductive electrodes having both the metal oxide-comprising material and the etch stop material therebetween. Other implementations are contemplated.
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