Invention Grant
- Patent Title: Semiconductor devices and methods of fabricating the same
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US14681313Application Date: 2015-04-08
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Publication No.: US09337149B2Publication Date: 2016-05-10
- Inventor: Dong-Hyun Im , Hyun Park , Soongun Lee , Chang Seok Lee , Sangwon Kim , Seongjun Park , Hyeon Jin Shin , Hanjin Lim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co, Ltd.
- Current Assignee: Samsung Electronics Co, Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, P.A.
- Priority: KR10-2014-0096665 20140729; KR10-2014-0147258 20141028
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L23/532 ; H01L27/108 ; H01L23/528 ; H01L21/02 ; H01L21/3213 ; H01L29/06 ; H01L21/768

Abstract:
Semiconductor devices may include a substrate including an active region defined by a device isolation layer, source/drain regions in the active region, word lines extending in a first direction parallel to the active region and being arranged in a second direction crossing the first direction, a bit line pattern extending in the second direction and crossing over a portion of the active region positioned between the word lines, and a graphene pattern covering at least a portion of the bit line pattern.
Public/Granted literature
- US20160035676A1 Semiconductor Devices and Methods of Fabricating the Same Public/Granted day:2016-02-04
Information query
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