Invention Grant
- Patent Title: Beam-induced deposition of low-resistivity material
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Application No.: US14799397Application Date: 2015-07-14
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Publication No.: US09334568B2Publication Date: 2016-05-10
- Inventor: Steven Randolph , Clive D. Chandler
- Applicant: FEI Company
- Applicant Address: US OR Hillsboro
- Assignee: FEI Company
- Current Assignee: FEI Company
- Current Assignee Address: US OR Hillsboro
- Agency: Scheinberg & Associates, P.C.
- Agent Michael O. Scheinberg
- Main IPC: H05H1/24
- IPC: H05H1/24 ; C23C16/48 ; C23C16/18 ; H01L21/285 ; H01L21/768

Abstract:
An improved method of beam deposition to deposit a low-resistivity metal. Preferred embodiments of the present invention use a novel focused ion beam induced deposition precursor to deposit low-resistivity metallic material such as tin. Applicants have discovered that by using a methylated or ethylated metal such as hexamethylditin as a precursor, material can be deposited having a resistivity as low as 40 μΩ·cm.
Public/Granted literature
- US20160010211A1 BEAM-INDUCED DEPOSITION OF LOW-RESISTIVITY MATERIAL Public/Granted day:2016-01-14
Information query
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