Invention Grant
US09319765B2 MEMS microphone assembly and method of manufacturing the MEMS microphone assembly
有权
MEMS麦克风组件和制造MEMS麦克风组件的方法
- Patent Title: MEMS microphone assembly and method of manufacturing the MEMS microphone assembly
- Patent Title (中): MEMS麦克风组件和制造MEMS麦克风组件的方法
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Application No.: US14388144Application Date: 2012-05-02
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Publication No.: US09319765B2Publication Date: 2016-04-19
- Inventor: Jan Tue Ravnkilde
- Applicant: Jan Tue Ravnkilde
- Applicant Address: DE München
- Assignee: Epcos AG
- Current Assignee: Epcos AG
- Current Assignee Address: DE München
- Agency: Nixon Peabody LLP
- International Application: PCT/EP2012/058031 WO 20120502
- International Announcement: WO2013/164021 WO 20131107
- Main IPC: H04R1/08
- IPC: H04R1/08 ; H04R19/00 ; H04R31/00
Abstract:
The present invention concerns a MEMS microphone assembly (1) comprising a MEMS transducer element (2) comprising a MEMS die (3), a back plate (4) and a diaphragm (5) displaceable in relation to the back plate (4), and a sound inlet (16) for acoustically coupling the MEMS transducer element (2) to the exterior of the MEMS microphone assembly (1), wherein the MEMS die (3) comprises an indentation (17) that forms at least a part of the sound inlet (16). Further, the present invention concerns a method of manufacturing said MEMS microphone assembly (1).
Public/Granted literature
- US20150054098A1 MEMS MICROPHONE ASSEMBLY AND METHOD OF MANUFACTURING THE MEMS MICROPHONE ASSEMBLY Public/Granted day:2015-02-26
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