发明授权
- 专利标题： Non-circular die package interconnect
- 专利标题（中）： 非圆形芯片封装互连
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申请号： US14334390申请日： 2014-07-17
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公开(公告)号： US09305901B2公开(公告)日： 2016-04-05
- 发明人: Frank Dropps
- 申请人： Seagate Technology LLC
- 申请人地址： US CA Cupertino
- 专利权人： Seagate Technology LLC
- 当前专利权人： Seagate Technology LLC
- 当前专利权人地址： US CA Cupertino
- 代理机构： Hall Estill Attorneys at Law
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01L25/00 ; H01L25/065 ; H01L23/538 ; H01L23/532 ; H01L21/768
摘要：
A computing component may consist of a die package that has at least a board, first computing layer, and second computing layer. Dielectric layers can separate each of the board, first computing layer, and second computing layer. The first computing layer may be disposed between the board and second computing layer. One or more interconnects can continuously extend from the second computing layer to the board with a non-circular cross-section shape.
公开/授权文献
- US20160020192A1 Non-Circular Die Package Interconnect 公开/授权日：2016-01-21
信息查询
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