发明授权
US09266203B2 Part being centered during assembly process, wafer level parts assembly, and apparatus and method to manufacture wafer level parts assembly
有权
部件在组装过程中集中，晶片级部件组装，以及用于制造晶片级部件组件的装置和方法
- 专利标题： Part being centered during assembly process, wafer level parts assembly, and apparatus and method to manufacture wafer level parts assembly
- 专利标题（中）： 部件在组装过程中集中，晶片级部件组装，以及用于制造晶片级部件组件的装置和方法
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申请号： US12488180申请日： 2009-06-19
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公开(公告)号： US09266203B2公开(公告)日： 2016-02-23
- 发明人: Eun-sung Lee , Min-seog Choi
- 申请人： Eun-sung Lee , Min-seog Choi
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Sughrue Mion, PLLC
- 优先权： KR10-2008-0086339 20080902
- 主分类号： G02B3/00
- IPC分类号： G02B3/00 ; B23P19/00 ; B23P19/10 ; G02B7/00 ; G02B7/02 ; G02B13/18
摘要：
A part to be centered during an assembly process includes an effective portion which performs a function and is shaped for insertion into a hole, a reference portion extended from the effective portion and formed substantially perpendicular to a center axis of the effective portion, and an aligning portion extended from the effective portion and formed around the effective portion. When the effective portion of the part is inserted into the hole, a center of the effective portion is automatically aligned with a centerline of the hole.
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