发明授权
- 专利标题: Socket and electronic component mounting structure
- 专利标题(中): 插座和电子元件安装结构
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申请号: US14088902申请日: 2013-11-25
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公开(公告)号: US09252513B2公开(公告)日: 2016-02-02
- 发明人: Yasushi Masuda , Akira Tamura , Yoshihiro Morita , Satoshi Ohsawa
- 申请人: FUJITSU LIMITED
- 申请人地址: JP Kawasaki
- 专利权人: FUJITSU LIMITED
- 当前专利权人: FUJITSU LIMITED
- 当前专利权人地址: JP Kawasaki
- 代理机构: Staas & Halsey LLP
- 优先权: JP2012-264276 20121203
- 主分类号: H01R31/06
- IPC分类号: H01R31/06 ; H05K1/11 ; H01R12/71 ; H05K7/10
摘要:
A socket includes a plurality of coupling members that each include a first end portion and a second end portion, the coupling members being made of electrically conductive material, wherein a terminal of an electronic component and a terminal of a board are electrically coupled with the first end portion and the second end portion, respectively, so to electrically connect the terminal of the electronic component and the terminal of the board, a holding member that holds the plurality of coupling members in such a manner that the plurality of coupling members are not in contact with each other, the holding member being made form an electrical insulating material, and a sheet member that is in contact with the electronic component and the board in parts between the plurality of coupling members, the sheet member being made from a material which is electrical insulating and thermal diffusive.
公开/授权文献
- US20140154925A1 SOCKET AND ELECTRONIC COMPONENT MOUNTING STRUCTURE 公开/授权日:2014-06-05
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