发明授权
US09252072B2 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
有权
组装包括通过晶片通孔的多个通孔，冷却组件的方法和制造组件的方法
- 专利标题： Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
- 专利标题（中）： 组装包括通过晶片通孔的多个通孔，冷却组件的方法和制造组件的方法
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申请号： US14096729申请日： 2013-12-04
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公开(公告)号： US09252072B2公开(公告)日： 2016-02-02
- 发明人: Kerry Bernstein , Thomas Brunschwiler , Bruno Michel
- 申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理机构： McGinn IP Law Group, PLLC
- 代理商 Vazken Alexanian
- 主分类号： H01L23/46
- IPC分类号： H01L23/46 ; H01L23/473 ; H01L25/065 ; H01L23/498
摘要：
An assembly includes a chip including an integrated circuit, a casing including an integrated circuit including plural active elements and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.
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