Invention Grant
US09238751B2 Polyimide precursor composition, method for preparing polyimide, polyimide prepared by using the method, and film including the polyimide
有权
聚酰亚胺前体组合物，制备聚酰亚胺的方法，使用该方法制备的聚酰亚胺和包含聚酰亚胺的薄膜
- Patent Title: Polyimide precursor composition, method for preparing polyimide, polyimide prepared by using the method, and film including the polyimide
- Patent Title (中): 聚酰亚胺前体组合物，制备聚酰亚胺的方法，使用该方法制备的聚酰亚胺和包含聚酰亚胺的薄膜
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Application No.: US14202182Application Date: 2014-03-10
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Publication No.: US09238751B2Publication Date: 2016-01-19
- Inventor: Woo-Jin Bae , Sung Woo Hong , Byung Hee Sohn , Won Suk Chang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KP
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KP
- Agency: Cantor Colburn LLP
- Priority: KR10-2013-0068055 20130613
- Main IPC: C09D179/08
- IPC: C09D179/08 ; C08G73/10 ; C08K9/04 ; C08K3/36 ; C08K3/22
Abstract:
A polyimide precursor composition, including a polyamic acid including a repeating unit represented by Chemical Formula 1 and transparent metal oxide nanoparticles coordinated to a ligand represented by RCOOH, wherein R is a linear or branched C1-C4 alkyl or a linear or branched C2-C4 alkenyl: wherein variables Cy, A3, R31, and n34 in Chemical Formula I are described in the specification.
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