Invention Grant
- Patent Title: Modular structural stiffeners
- Patent Title (中): 模块化结构加强筋
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Application No.: US14023364Application Date: 2013-09-10
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Publication No.: US09236649B2Publication Date: 2016-01-12
- Inventor: Daniel W. Jarvis , Miguel C. Christophy , Richard Hung Minh Dinh
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; G06F1/16 ; H04M1/02 ; H04M1/18

Abstract:
A housing for a personal electronic device is described herein. The housing may include at least structural member configured to be arranged within an internal cavity of the housing. The at least structural member is aligned with a feature external to the housing. The at least one structural member is affixed to an interior surface of the internal cavity. Furthermore, the at least structural member and housing are co-machined to define a coaxial aperture for accepting the feature.
Public/Granted literature
- US20140361669A1 MODULAR STRUCTURAL STIFFENERS Public/Granted day:2014-12-11
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