发明授权
- 专利标题: Modular interface systems and methods
- 专利标题(中): 模块化接口系统和方法
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申请号: US13825638申请日: 2010-09-22
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公开(公告)号: US09219462B2公开(公告)日: 2015-12-22
- 发明人: Adnan A. Siddiquie , Fangyong Dai , Luis C. Armendariz
- 申请人: Adnan A. Siddiquie , Fangyong Dai , Luis C. Armendariz
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 代理机构: HP Legal Department
- 国际申请: PCT/US2010/049861 WO 20100922
- 国际公布: WO2012/039710 WO 20120329
- 主分类号: H03H7/01
- IPC分类号: H03H7/01 ; H01R13/66 ; H03H7/06 ; H01R13/719 ; H01R24/64
摘要:
Interface systems and methods are provided. An interface system can include a first isolator (200) and a second isolator (300) coupled to a modular interface (110). The interface can include a plurality of conductors (120). The first isolator can be coupled to a first signal format compliant first input/output (I/O) device (130). The second isolator can be coupled to a second signal format compliant second I/O device (140). The first isolator can pass a first signal format compliant signal to, and suppress the reflection of at least a portion of a second signal format compliant signal from, the first I/O device. The second isolator can at least partially block a first signal format compliant signal from, and to pass a second signal format compliant signal to, the second I/O device.
公开/授权文献
- US20130187731A1 MODULAR INTERFACE SYSTEMS AND METHODS 公开/授权日:2013-07-25
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