Invention Grant
- Patent Title: Method for heating a substrate in a printing device
- Patent Title (中): 在印刷装置中加热基板的方法
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Application No.: US14286276Application Date: 2014-05-23
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Publication No.: US09211728B1Publication Date: 2015-12-15
- Inventor: Rodney Ray Bucks , W. Charles Kasiske, Jr. , John Leonard Hryhorenko , David Francis Cahill , James Alan Katerberg
- Applicant: Rodney Ray Bucks , W. Charles Kasiske, Jr. , John Leonard Hryhorenko , David Francis Cahill , James Alan Katerberg
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent Peyton C. Watkins; William R. Zimmerli
- Main IPC: B41J2/01
- IPC: B41J2/01 ; B41J11/00
Abstract:
A method for heating a substrate in a printing device, the method comprises positioning at least one radiant heater along a printing path of a printing device, the at least one radiant heater includes at least two emitters; measuring a voltage and current supplied to each of the at least two emitters; determining an electrical power supplied to each of the at least two emitters; and adjusting the electrical power supplied to at least one of the at least two emitters if a difference in power supplied to each of the at least two emitters exceeds a threshold.
Public/Granted literature
- US20150336398A1 METHOD FOR HEATING A SUBSTRATE IN A PRINTING DEVICE Public/Granted day:2015-11-26
Information query
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