Invention Grant
US09202778B2 Integrated circuit package with die attach paddle having at least one recessed portion
有权
集成电路封装，其具有至少一个凹陷部分的管芯附接焊盘
- Patent Title: Integrated circuit package with die attach paddle having at least one recessed portion
- Patent Title (中): 集成电路封装，其具有至少一个凹陷部分的管芯附接焊盘
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Application No.: US13974323Application Date: 2013-08-23
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Publication No.: US09202778B2Publication Date: 2015-12-01
- Inventor: You Chye How , Maria Christina Bernando Violante
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/495 ; H01L23/00
Abstract:
An integrated circuit package having a die attach paddle, a power die mounted on the die attach paddle and a controller die mounted on the die attach paddle. The die attach paddle has at least one recessed portion at least partially underlying the controller die.
Public/Granted literature
- US20150054145A1 INTEGRATED CIRCUIT PACKAGE WITH DIE ATTACH PADDLE HAVING AT LEAST ONE RECESSED PORTION Public/Granted day:2015-02-26
Information query
IPC分类:
